Driven by the rapid growth of new energy vehicles, AI servers, consumer electronics, medical devices, and intelligent manufacturing, electronics manufacturers are placing greater emphasis on improving PCBA yield, inspection accuracy, and production efficiency.

As SMT production lines become increasingly complex, manufacturers are actively seeking advanced AOI, AXI, and ICT solutions to reduce defects, optimize processes, and support smart factory transformation.

Against this backdrop, Fac Tec China 2026, co-located with NEPCON China 2026 and S-Factory Expo, will take place on June 2–4, 2026 at the Shanghai World Expo Exhibition & Convention Center.

Among the featured exhibitors, TRI will present its latest PCBA inspection and testing solutions, including:

• TR7500QE Plus Automated Optical Inspection (AOI) System
• TR7600LL SV Automated X-ray Inspection (AXI) System
• TR8100 SII In-Circuit Test (ICT) Series

Booth No.: 1G80

TRI Delivers One-Stop Smart Factory Inspection Solutions

TRI is a leading provider of automated inspection and smart manufacturing solutions for the electronics industry.

The company offers a comprehensive portfolio covering:

• 3D Solder Paste Inspection (SPI)
• 3D Automated Optical Inspection (AOI)
• 3D Automated X-ray Inspection (AXI)
• Manufacturing Defect Analyzer (MDA)
• In-Circuit Testing (ICT)

TRI’s integrated Yield Management System (YMS 4.0) enables automatic collection of inspection data and images, helping manufacturers improve production yield, optimize process control, and accelerate Industry 4.0 implementation.

TR7500QE Plus AOI: AI-Driven High-Precision PCB Inspection

Advanced 5-Camera 3D Inspection Technology

The TR7500QE Plus AOI system features innovative AI-powered algorithms and enhanced mechanical capabilities for high-accuracy PCB inspection.

Equipped with a 5-camera multi-angle 3D inspection system, the platform can effectively detect:

• Inner-layer bridging
• Hidden lifted leads
• Shielded defects
• Soldering abnormalities

The solution is particularly suitable for high-density and high-complexity PCB assemblies.

Smart Factory Ready

The TR7500QE Plus supports modern smart factory communication standards including:

• IPC-CFX
• Hermes (IPC-HERMES-9852)

This allows seamless equipment connectivity and digital production line integration.

Key Features

• 5-camera multi-angle 3D inspection
• AI-driven inspection algorithms
• Smart programming capabilities
• Measurement-grade inspection
• Smart factory compatibility

Benefits for Electronics Manufacturers

By automatically collecting measurement data and inspection images, the TR7500QE Plus helps manufacturers:

• Improve PCBA inspection accuracy
• Reduce false calls
• Increase SMT line yield
• Optimize process efficiency

TR7600LL SV AXI: High-Speed 3D X-ray Inspection for Higher Yield

Accurate Void Detection Powered by AI

The TR7600LL SV series is TRI’s newly launched linear-scanning 3D AXI platform. Compared with the award-winning TR7600 SIII series, overall performance has improved by up to 20%.

Powered by advanced AI algorithms, the system can accurately detect:

• Void defects
• BGA solder joint issues
• Hidden soldering defects
• Internal structural abnormalities

It is ideal for automotive electronics, servers, power modules, and other high-reliability applications.

7 μm High-Resolution Imaging

The TR7600LL SV delivers 7 μm high-resolution inspection capability for more precise X-ray analysis.

The platform also features:

• EtherCAT motion controller
• Real-time measurement capability
• MES connectivity for smart factory integration

Key Features

• High-speed 3D AXI inspection
• AI-powered defect detection
• 7 μm high-resolution imaging
• EtherCAT real-time control
• MES integration support

Benefits for Manufacturers

The TR7600LL SV helps manufacturers:

• Improve PCBA yield
• Reduce rework costs
• Increase inspection speed
• Enhance smart manufacturing efficiency

TR8100 SII ICT Series: High-Density In-Circuit Testing Solution

Supports Up to 11,088 Test Pins

The TR8100 SII series is TRI’s advanced ICT platform featuring:

• Digital no-MUX architecture
• 1:1 pin-to-test-point design

The system supports up to 11,088 test pins, making it suitable for highly complex PCB assemblies and advanced electronics products.

Stable & Accurate PCB Testing

The TR8100 SII automatically collects measurement data to help manufacturers:

• Improve test accuracy
• Enhance production stability
• Optimize PCBA processes
• Reduce defect rates

The solution is widely applicable across:

• Consumer electronics
• Automotive electronics
• Industrial control
• Communication equipment
• Medical electronics

Join industry professionals from around the world at the Shanghai World Expo Exhibition & Convention Center on June 2–4, 2026, and visit TRI. at Booth 1G80 to discover the latest PCBA inspection and smart manufacturing solutions.

If interested in exhibiting at Fac Tec China 2026, please contact

Ms. Julia Gu

Tel: +86 21-2231-7010

Email: [email protected] 

If interested in visiting Fac Tec China 2026, please contact

Mr. Walden Li

Email:  [email protected] , [email protected]  

Mobile/WhatsApp/WeChat:  +86 136-5125-1335

For more information, please visit  Fac Tec China – your gateway to factories of tomorrow.

Pre-Register: ali2.infosalons.com.cn/reg/FTC26/Web/FTC26/index.html#/login?lang=en-US&page=public&type=JZ7BO7