Fac Tec China and NEPCON China, the leading exhibitions dedicated to the electronics manufacturing industry, will be held from June 2–4, 2026 at the Shanghai World Expo Exhibition & Convention Center.

Under the theme of “Advanced Factory Facilities”, the event brings together global innovators to showcase cutting-edge solutions for smart, flexible, and green manufacturing. Covering key electronics production processes including SMT, testing & measurement, soldering, dispensing & coating, ESD protection, and green factory technologies, the exhibition will present the latest technologies, products, and industry trends driving the future of electronics manufacturing.

Explore the Latest Innovations in Smart, Green & Flexible Electronics Manufacturing

Visitors will gain direct access to advanced soldering technologies, intelligent reflow systems, selective wave soldering solutions, precision repair equipment, and energy-efficient manufacturing technologies from leading global suppliers.

Apollo Seiko (Shanghai) Industrial Corporation

Booth No.: 1G03

Selective Wave Soldering System – AF iN4050A

Product Highlights

This integrated selective wave soldering system supports three production processes and can be connected directly to conveyor-based production lines.

Especially suitable for high-mix, low-volume manufacturing environments, the system enables:

• Low heat-input precision soldering
• Reduced post-solder correction and annealing processes
• Lower downstream heat-treatment energy consumption
• Indirect carbon emission reduction

Shenzhen ZSW Electronic Equipment Co., Ltd.

Booth No.: 1G25

Inline Selective Wave Soldering Modular System (Independent Spray Module)

Product Highlights

The selective wave soldering system consists of:

• Flux spraying module
• Preheating module
• Soldering module

Through programmable control, the system enables selective spraying and point-by-point soldering for each solder joint. Individual soldering parameters can be independently adjusted for every joint, ensuring higher process precision and flexibility.

Shenzhen AREED Technology Co., Ltd.

Booth No.: 1F35

Solder Sheet Cutting Feeder – LBC-XP

Product Highlights

The solder sheet cutting feeder is an automated solution designed for power semiconductor (IGBT) manufacturing.

The system supports:

• Adjustable cutting specifications according to wafer size
• Die-cut solder sheets for capacitor and resistor soldering applications
• Feeding length around 0.8 mm

The equipment is compatible with mainstream tin-based and lead-based solder strips.

SHENZHEN DINGHUA TECHNOLOGY DEVELOPMENT CO.,LTD

Booth No.: 1D55

BGA Rework Station – DH-A5

Product Highlights

Designed for PCBA rework applications, the DH-A5 supports:

• Defective component repair
• Chip removal
• Precise alignment soldering

The system improves maintenance efficiency and reduces PCB repair costs for SMT production environments.

REHM THERMAL SYSTEMS (DONGGUAN) LTD.

Booth No.: 1C60

Nexus Contact Soldering System

Product Highlights

Featuring void-free vacuum soldering technology, the Nexus contact soldering system is suitable for a wide range of industrial applications requiring high-reliability soldering performance.

Shenzhen Xinggaojingda Hardware & Electromechanical Co., Ltd.

Booth No.: 1D02

Selective Wave Soldering Nozzles

Product Models

3-6-47 / 4-8-47 / 6-10-47 / 8-12-47 / 10-14-47

Product Highlights

• Service life of 400–600 hours
• Environmentally friendly and harmless to the environment

Shenzhen Leader Innovation Co., Ltd.

Booth No.: 1J01

Germany Ersa Intelligent Reflow Oven Series

Product Highlights

The complete Ersa intelligent reflow oven series from Germany supports:

• Nitrogen and air process configurations
• SMT and semiconductor production lines
• Multi-zone independent precision temperature control

Designed for high-reliability soldering applications including automotive electronics and semiconductor manufacturing, the system features:

• Modular design
• Low energy consumption
• High operational stability

The technology significantly reduces:

• Solder voids
• Cold solder joints
• Temperature deviation issues

while supporting various PCB sizes and complex component soldering requirements.

Energy-Efficient & Smart Manufacturing Features

The Ersa reflow ovens are equipped with:

• Intelligent energy optimization systems
• High-efficiency thermal insulation technology
• Precise temperature control
• Smart nitrogen flow management and oxygen closed-loop control (for nitrogen models)
• Low-power fan systems

These features help reduce energy consumption, improve soldering yield, minimize rework waste, and support low-carbon electronics manufacturing.

Key Benefits

1. Improves soldering yield and reliability by reducing voids and cold solder defects
2. Supports diverse substrates, solder paste types, and component requirements for automotive electronics and semiconductor applications
3. Reduces energy consumption and maintenance costs while improving production efficiency and minimizing downtime

Join Fac Tec China & NEPCON China 2026

From selective wave soldering and intelligent reflow systems to semiconductor solder feeding technologies and advanced BGA rework solutions, Fac Tec China & NEPCON China 2026 will serve as a comprehensive sourcing and networking platform for the global electronics manufacturing industry.

Connect with leading suppliers and discover the next generation of smart, green, and high-efficiency soldering technologies.

If interested in exhibiting at Fac Tec China 2026, please contact

Ms. Julia Gu

Tel: +86 21-2231-7010

Email: [email protected] 

If interested in visiting Fac Tec China 2026, please contact

Mr. Walden Li

Email:  [email protected] , [email protected]  

Mobile/WhatsApp/WeChat:  +86 136-5125-1335

For more information, please visit  Fac Tec China – your gateway to factories of tomorrow.

Pre-Register: ali2.infosalons.com.cn/reg/FTC26/Web/FTC26/index.html#/login?lang=en-US&page=public&type=9XU8RK