Fac Tec China and NEPCON China, the leading exhibitions tailored for the electronics manufacturing industry, will take place from June 2–4, 2026 at the Shanghai World Expo Exhibition & Convention Center.

Under the theme of “Advanced Factory Facilities”, the exhibition will gather global innovators to showcase cutting-edge solutions for smart, flexible, and green manufacturing. Covering critical electronics production processes including SMT, testing & measurement, soldering, dispensing & coating, ESD protection, and green factory technologies, the event will present the latest products, technologies, and industry trends shaping the future of electronics manufacturing.

Explore the Latest Global Innovations in Green, Smart & Flexible Manufacturing

Visitors will gain first-hand access to next-generation testing and measurement technologies, intelligent inspection systems, advanced imaging solutions, and AI-powered manufacturing equipment from leading suppliers across the production supply chain.

SHENZHEN HUAXIAN OPTICAL INSTRUMENT CO., LTD

Booth No.: 1F03

2D/3D High-Definition Video Microscope – EC-S4

Product Highlights

Featuring 4K ultra-HD imaging and MES traceability support, the EC-S4 is designed for smart factory applications including:

• Solder climbing inspection
• False soldering and missing solder detection
• Hole wall burr inspection

Key Features

• Real-time switching between 2D and 3D stereo observation
• Four-drive lighting system with full-field illumination and enhanced 14K image quality
• MES system connectivity
• Customizable 300 × 300 mm movable platform
• 360-degree observation for precision metal parts and SMT solder joints

Huaxian Optical provides a low-carbon and energy-efficient microscopy solution by replacing traditional halogen lamps with ultra-low-power, long-life LED light sources, reducing electricity consumption by over 80% while significantly lowering consumable waste and carbon emissions.

Its 3D microscope solutions enable rapid inspection of electronic components, solder joints, PCB/FPC flexible boards, and precision structural parts, supporting:

• 3D height difference measurement
• Flatness and coplanarity inspection
• Burr and deformation analysis
• Process control and failure analysis throughout electronics manufacturing

TRI

Booth No.: 1G80

TR7600LL SV Automated X-Ray Inspection System

Product Highlights

The TR7600LL SV Series is TRI’s latest linear-scanning 3D AXI solution. Compared with the award-winning TR7600 SIII Series, inspection performance has improved by up to 20%.

Powered by AI-driven algorithms, the high-speed 3D AXI system delivers precise void defect inspection with 7 μm high-resolution imaging for high-yield manufacturing.

Key Features

• EtherCAT motion controller for real-time measurement and easier maintenance
• AI-powered defect detection algorithms
• Seamless MES connectivity for smart factories
• Automated PCB inspection with image and data collection for yield optimization and process improvement

KASION AUTOMATION LTD

Booth No.: 1E60

Fully Automatic Chip Programmer – EPV7900

Product Highlights

The EPV7900 is a high-speed, secure, and universal automated chip programming system designed to support nearly all programming requirements.

Supporting MCU, UFS, eMMC, NAND/NOR Flash, and Serial Flash devices, the system offers universal compatibility from ultra-small CSP devices to UFS components.

Key Advantages

• Read speed up to 440 MB/s and write speed up to 201 MB/s
• Reduced programming time and improved production efficiency
• Universal programming platform supporting multiple chip packages without changing dedicated programmers
• High-reliability data programming to prevent data loss or programming failures
• Custom development support for MES integration, encryption, and serial number programming
• Intelligent traceability and permission management systems
• Innovative detachable socket design to reduce consumable costs

Shenzhen Jieniu Technology Co., Ltd.

Booth No.: 1E15

High & Low Temperature Aging Test Chamber – HJCS-GDW-01

Product Highlights

The system is designed to evaluate product and material reliability under extreme temperature conditions.

Testing Capabilities

High-Temperature Testing

• Material softening
• Performance degradation
• Oxidation and potential damage

Low-Temperature Testing

• Cracking and embrittlement
• Mechanical jamming
• Functional characteristic changes

Triertech Co. ,Ltd.

Booth No.: 1E70

T7600 PCB Inspection Equipment

Product Highlights

The Triertech T7600 is a precision PCB measurement system designed for PCB process inspection applications.

The system accurately measures:

• PCB warpage
• Back-drill depth

Equipped with:

• High-resolution cameras
• Telecentric lenses
• XY linear guide platform
• Z-axis autofocus system

The equipment integrates advanced AI algorithms to improve measurement efficiency while simplifying setup procedures. Full-board image data can be stored for process traceability and customized reporting.

Sanying Precision Instruments Co,.Ltd

Booth No.: 1B03

Inline 3D AXI System

Product Highlights

The EFPscan 2150 Series from Sanying Precision is designed for SMT and semiconductor applications.

Based on 3D CT imaging technology, the system enables high-speed, fully automated inline inspection of invisible solder joints and solder layers.

Shenzhen Sunmenta Electronics Co., Ltd.

Booth No.: 1G27

SVII-K200Pro

Product Highlights

The fully automated 3D stencil inspection system features advanced 3D inspection capabilities.

Using laser displacement sensors, the system automatically scans 3D point cloud data to inspect:

• Surface scratches
• Flatness
• Concavity and convexity
• Stencil thickness

It also captures 2D images for inspection of:

• Aperture dimensions
• Aperture area
• Multi-hole defects
• Blocked holes
• Burrs
• Tension defects

The solution is designed for intelligent, low-carbon, and energy-efficient manufacturing environments.

Join Fac Tec China & NEPCON China 2026

From AI-powered AXI systems and precision optical inspection to advanced chip programming and smart factory integration, Fac Tec China & NEPCON China 2026 will serve as a comprehensive sourcing and networking platform for the global electronics manufacturing industry.

Join industry leaders and discover the latest innovations driving the future of smart, green, and flexible electronics production.

If interested in exhibiting at Fac Tec China 2026, please contact

Ms. Julia Gu

Tel: +86 21-2231-7010

Email: [email protected] 

If interested in visiting Fac Tec China 2026, please contact

Mr. Walden Li

Email:  [email protected] , [email protected]  

Mobile/WhatsApp/WeChat:  +86 136-5125-1335

For more information, please visit  Fac Tec China – your gateway to factories of tomorrow.

Pre-Register: ali2.infosalons.com.cn/reg/FTC26/Web/FTC26/index.html#/login?lang=en-US&page=public&type=9XU8RK