Seize the Green Manufacturing Advantage | Global Leaders Gather at the Global Next Generation Factory Summit

Looking to stay ahead of policy trends, overcome transformation challenges, and seize opportunities in green development? This industry-leading event tailored for the electronics manufacturing sector will provide comprehensive solutions to help you break through.


Jointly organized by the China Green Supply Chain Alliance and RX Global, the Global Next Generation Factory Summit — Green Manufacturing and Sustainable Development will take place on June 2, 2026, at the Shanghai World Expo Exhibition & Convention Center.


The speaker and participant lineup has recently been significantly updated. Leading policy authorities, global industry leaders, technology pioneers, and certification bodies are expected to join, delivering a high-level, high-value, and highly targeted summit covering policy frameworks, best practices, technological breakthroughs, and compliance guidance.


This summit will help electronics manufacturers overcome barriers across policy, technology, implementation, and compliance—enabling cost reduction, efficiency improvement, and high-quality development.

 Event Overview

Event Name:
Global Next Generation Factory Summit — Green Manufacturing and Sustainable Development

Date:
June 2, 2026, 9:00–17:30

Theme:
Morning: Policy Insights & Industry Trends
Afternoon: Key Technologies & Case Studies

Venue:
Shanghai World Expo Exhibition & Convention Center

Organizer:
China Green Supply Chain Alliance & RX Global

 Target Audience:
Senior executives in electronics manufacturing | Production / Supply Chain / ESG leaders | Green technology & equipment providers | Industry research & service professionals

Key Highlights

• First-hand policy insights from authoritative institutions such as MIIT-affiliated organizations, covering green manufacturing policies and compliance standards

• Proven practices from global leaders such as Lenovo, Haier, and Schneider Electric, focusing on real-world, scalable implementation

• End-to-end solutions covering green design, PV & energy storage, low-carbon materials, carbon accounting, certification, and testing

• Dedicated business matching sessions to connect technology providers with procurement and production leaders for precise cooperation

2026 SMTA China East Technical Conference

2 June 2026(Tuesday)

Venue
Room No.5, B2, Shanghai World Expo Exhibition & Convention Center

Conference Chairman
Leo Hu ,Member of SMTA China Technical Advisory Committee,Senior Area Technical Manager-East China of Indium Corporation

Time

Topic

Speaker

10:45 - 11:10

Closed-Loop IloT Control for Green and Intelligent Uniplate PCB Factory:A Data-Driven Approach Integrating Domain Expertise

Giovanni Obino
Ametek (China) Chemical Co., Ltd.

11:10 - 11:15

Prize Quiz

11:15 - 11:40

Advanced Process Digitalization Platform: Reconstructing Process Combat Power

Danxia Li
ZTE Corporation

11:40 - 11:45

Prize Quiz

11:45 - 12:10

Investigating Test Methods for Electrochemical Consistency In PCB Assembly Processes

Raymond Luo
Indium Corporation

12:10 - 12:15

Prize Quiz

SMTA International Forum 2026

2 June 2026(Tuesday)

13:30 - 15:30

Power Electronics New Integration Concepts — High-Performance Power Modules

Lars Boettcher

Lars Boettcher
Member of the SMTA International Conference Technical Committee, Technical Chair of the IMAPS Device Packaging Conference
Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, Germany
R&D Engineer, Project Manager, Head of Embedded and Substrate Technology Team

With 27 years of working experience in the field of system integration and interconnection technology, his core research focus is the development of packaging processes based on printed circuit board (PCB) manufacturing technology. He has led numerous industrial collaboration projects as well as German and EU-funded projects, with a primary focus on novel packaging technologies based on chip embedding technology and advanced substrate technologies. His recent projects center on power electronics application technologies, component embedding technology, and panel-level packaging (PLP) technology for ultra-fine line/space applications.

Stay tuned for more highlights!


The summit lineup and session topics are continuously being upgraded, with more industry-leading speakers, cutting-edge solutions, and exclusive attendee benefits to be announced soon.
Follow us to stay updated on the latest developments, and seize valuable opportunities to engage with industry leaders, access targeted resources, and gain a competitive edge in the green manufacturing sector.


Join us on June 2, 2026, at the Shanghai World Expo Exhibition & Convention Center to embark on a new journey toward green and sustainable development in the electronics manufacturing industry.

If interested in exhibiting at Fac Tec China 2026, please contact

Ms. Julia Gu

Tel: +86 21-2231-7010

Email: [email protected] 

 

If interested in visiting Fac Tec China 2026, please contact

Mr. Walden Li

Email:  [email protected] , [email protected]  

Mobile/WhatsApp/WeChat:  +86 136-5125-1335

 

For more information, please visit  Fac Tec China – your gateway to factories of tomorrow.

 

Pre-Register: ali2.infosalons.com.cn/reg/FTC26/Web/FTC26/index.html#/login?lang=en-US&page=public&type=9XU8RK